Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCN...

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Bibliographic Details
Main Authors: Dele-Afolabi, T. T., M. A., Azmah Hanim, K., Vidyatharran, K. A., Matori, O., Saliza Azlina, R., Calin
Format: Article
Language:English
Published: Springer Link 2022
Subjects:
T Technology (General)
Online Access:http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf
http://eprints.uthm.edu.my/7099/
https://doi.org/10.1007/s10854-022-07974-8
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Institution: Universiti Tun Hussein Onn Malaysia
Language: English

Internet

http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf
http://eprints.uthm.edu.my/7099/
https://doi.org/10.1007/s10854-022-07974-8

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