Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

• Main Authors: Dele-Afolabi, T. T., M. A., Azmah Hanim, K., Vidyatharran, K. A., Matori, O., Saliza Azlina, R., Calin
• Format: Article
• Language: English
• Published: Springer Link 2022
• Subjects: T Technology (General)
• Online Access: http://eprints.uthm.edu.my/7099/1/J14082_28711dfb5865d2e17b8bcb627ff5ed56.pdf; http://eprints.uthm.edu.my/7099/; https://doi.org/10.1007/s10854-022-07974-8
• Institution: Universiti Tun Hussein Onn Malaysia

The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCN...