Characterisation of electroless deposition parameter of copper on silicon wafer for through silicon via application

• Main Author: Mior Shahidin, Shazatul Akmaliah
• Format: Thesis
• Language: English
• Published: 2019
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/101922/1/ShazatulAkmaliahMiorShahidinMSKM2019.pdf; http://eprints.utm.my/id/eprint/101922/; http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:148441
• Institution: Universiti Teknologi Malaysia

Through silicon via (TSV) is a structure through entire Si substrate that enables vertical electrical connections between chips. Recently, the electroless deposition of Cu using a chemical bath has received considerable attention as a promising technique for the TSV filling process. Even the advanta...