Deformation and stresses in electronic package due to thermal cycling
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| Main Authors: | , |
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| Format: | Book Section |
| Published: |
Penerbit UTM
2008
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/19286/ |
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| Institution: | Universiti Teknologi Malaysia |
| Description not available. |