Deformation and stresses in electronic package due to thermal cycling
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2008
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Online Access: | http://eprints.utm.my/id/eprint/19286/ |
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my.utm.192862012-01-14T05:02:47Z http://eprints.utm.my/id/eprint/19286/ Deformation and stresses in electronic package due to thermal cycling Lai, Zheng Bo Kamsah, Nazri TK Electrical engineering. Electronics Nuclear engineering Penerbit UTM 2008 Book Section PeerReviewed Lai, Zheng Bo and Kamsah, Nazri (2008) Deformation and stresses in electronic package due to thermal cycling. In: Advances in Thermo-Fluids. Penerbit UTM , Johor. ISBN 978-983-52-0541-5 |
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TK Electrical engineering. Electronics Nuclear engineering |
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TK Electrical engineering. Electronics Nuclear engineering Lai, Zheng Bo Kamsah, Nazri Deformation and stresses in electronic package due to thermal cycling |
format |
Book Section |
author |
Lai, Zheng Bo Kamsah, Nazri |
author_facet |
Lai, Zheng Bo Kamsah, Nazri |
author_sort |
Lai, Zheng Bo |
title |
Deformation and stresses in electronic package due to thermal cycling |
title_short |
Deformation and stresses in electronic package due to thermal cycling |
title_full |
Deformation and stresses in electronic package due to thermal cycling |
title_fullStr |
Deformation and stresses in electronic package due to thermal cycling |
title_full_unstemmed |
Deformation and stresses in electronic package due to thermal cycling |
title_sort |
deformation and stresses in electronic package due to thermal cycling |
publisher |
Penerbit UTM |
publishDate |
2008 |
url |
http://eprints.utm.my/id/eprint/19286/ |
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1643647103669370880 |