Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in Pb-free solder interconnects

• Main Authors: Yamin, A. F. M., Shaffiar, N. M., Loh, W. K., Tamin, Mohd. Nasir
• Format: Conference or Workshop Item
• Published: 2012
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/40122/; http://dx.doi.org/10.1109/IEMT.2012.6521786
• Institution: Universiti Teknologi Malaysia

The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Perform...