Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

by Shaffiar, Norhashimah, Loh, W.K., Kamsah, N.
Published 2010

Continuum damage evolution in pb-free solder joint under shear fatigue loadings

by Shaffiar, Norhashimah, Loh, W.K., Kamsah, N., Tamin, M.N.
Published 2010

Damage progression in BGA solder joints during board-level drop test

by Yamin, A.F.M., Shaffiar, Norhashimah, Loh, W.K., Tamin, M.N.
Published 2011

Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models

by Shaffiar, Norhashimah, Yamin, A.F.M., Loh, W.K., Tamin, M.N.
Published 2012

Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

by Yamin, A.F.M., Shaffiar, N.M., Loh, W.K., Tamin, M.N.
Published 2012

Solder joint fatigue in a surface mount assembly subjected to mechanical loading

by Tamin, M. N., Liew, Y. B., Wagiman, A. N. R., Loh, W. K.
Published 2007

Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in Pb-free solder interconnects

by Yamin, A. F. M., Shaffiar, N. M., Loh, W. K., Tamin, Mohd. Nasir
Published 2012

Conferencing spread spectrum radio

by Lye, K.M., Tjhung, T.T., Chua, K.C., Pek, T.C., Yung, W.H., Goh, W.P., Chia, Y.P., Loh, W.K., Ma, F.L., Low, K.M.
Published 2014