Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic

The present work includes a process for encapsulation by combining substantially simultaneously dry nonmetallic printed circuit boards (PCBs) powder and recycled high-density polyethylene (rHDPE) in an extruder to form a homogenous matrix. The extruded materials were then molded into standard tensil...

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Main Authors: Muniyandi, Shantha Kumari, Sohaili, Johan, Hassan, Azman
Format: Article
Published: Research Gate 2014
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Online Access:http://eprints.utm.my/id/eprint/52671/
http://dx.doi.org/10.1080/10962247.2014.911221
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Institution: Universiti Teknologi Malaysia
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spelling my.utm.526712018-06-29T22:37:57Z http://eprints.utm.my/id/eprint/52671/ Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic Muniyandi, Shantha Kumari Sohaili, Johan Hassan, Azman TA Engineering (General). Civil engineering (General) The present work includes a process for encapsulation by combining substantially simultaneously dry nonmetallic printed circuit boards (PCBs) powder and recycled high-density polyethylene (rHDPE) in an extruder to form a homogenous matrix. The extruded materials were then molded into standard tensile, flexural, and impact properties testing specimens. Nonmetallic PCB mainly consists of large amount of glass fiber-reinforced epoxy resin materials. Incorporation of 50 wt% nonmetallic PCB in rHDPE matrix had increased the flexural strength and modulus by 35% and 130%, respectively. Tensile strength reported to be constant without much improvement. However, the Young's modulus has increased by 180%, with incorporation of 50 wt% nonmetallic PCB. The addition of 6 phr (parts per hundred) maleated polyethylene (MAPE) resulted in 2-fold increase in tensile and flexural strength. Regarding the leaching properties, Cu was identified as the metal that leached at the highest level from the raw nonmetallic PCB, at 59.09 mg/L. However, after the nonmetallic PCB was filled in rHDPE/PCB composites, the concentration of Cu was reduced far below the regulatory limit, to only 3 mg/L. Thermal properties of composites were studied, and it was found out that incorporation of nonmetallic PCB fillers in rHDPE resulted in low thermal conductivity, whereas mechanical strength of the composites showed maximum improvements at 220 degrees C. Overall, the encapsulation technique using nonmetallic PCB waste has formed a monolithic waste form that provides a barrier to the dispersion of wastes into the environment Research Gate 2014 Article PeerReviewed Muniyandi, Shantha Kumari and Sohaili, Johan and Hassan, Azman (2014) Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic. Journal of the Air & Waste Management Association, 64 (9). pp. 1085-1092. ISSN 1096-2247 http://dx.doi.org/10.1080/10962247.2014.911221 DOI: 10.1080/10962247.2014.911221
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic TA Engineering (General). Civil engineering (General)
spellingShingle TA Engineering (General). Civil engineering (General)
Muniyandi, Shantha Kumari
Sohaili, Johan
Hassan, Azman
Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic
description The present work includes a process for encapsulation by combining substantially simultaneously dry nonmetallic printed circuit boards (PCBs) powder and recycled high-density polyethylene (rHDPE) in an extruder to form a homogenous matrix. The extruded materials were then molded into standard tensile, flexural, and impact properties testing specimens. Nonmetallic PCB mainly consists of large amount of glass fiber-reinforced epoxy resin materials. Incorporation of 50 wt% nonmetallic PCB in rHDPE matrix had increased the flexural strength and modulus by 35% and 130%, respectively. Tensile strength reported to be constant without much improvement. However, the Young's modulus has increased by 180%, with incorporation of 50 wt% nonmetallic PCB. The addition of 6 phr (parts per hundred) maleated polyethylene (MAPE) resulted in 2-fold increase in tensile and flexural strength. Regarding the leaching properties, Cu was identified as the metal that leached at the highest level from the raw nonmetallic PCB, at 59.09 mg/L. However, after the nonmetallic PCB was filled in rHDPE/PCB composites, the concentration of Cu was reduced far below the regulatory limit, to only 3 mg/L. Thermal properties of composites were studied, and it was found out that incorporation of nonmetallic PCB fillers in rHDPE resulted in low thermal conductivity, whereas mechanical strength of the composites showed maximum improvements at 220 degrees C. Overall, the encapsulation technique using nonmetallic PCB waste has formed a monolithic waste form that provides a barrier to the dispersion of wastes into the environment
format Article
author Muniyandi, Shantha Kumari
Sohaili, Johan
Hassan, Azman
author_facet Muniyandi, Shantha Kumari
Sohaili, Johan
Hassan, Azman
author_sort Muniyandi, Shantha Kumari
title Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic
title_short Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic
title_full Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic
title_fullStr Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic
title_full_unstemmed Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic
title_sort encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic
publisher Research Gate
publishDate 2014
url http://eprints.utm.my/id/eprint/52671/
http://dx.doi.org/10.1080/10962247.2014.911221
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