Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic
The present work includes a process for encapsulation by combining substantially simultaneously dry nonmetallic printed circuit boards (PCBs) powder and recycled high-density polyethylene (rHDPE) in an extruder to form a homogenous matrix. The extruded materials were then molded into standard tensil...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Research Gate
2014
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/52671/ http://dx.doi.org/10.1080/10962247.2014.911221 |
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| Institution: | Universiti Teknologi Malaysia |