Thermal performance analysis for optimal passive cooling heat sink design

Thermal performance analysis for optimal passive cooling heat sink design

Recent advances in semiconductor technology show the improvement of fabrication on electronics appliances in terms of performance, power density and even the size. This great achievement however led to some major problems on thermal and heat distribution of the electronic devices. This thermal probl...

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Bibliographic Details
Main Authors: Hisham, N. W. B., Ismail, F. S., Nawawi, M. A. A.
Format: Article
Language:English
Published: Universitas Ahmad Dahlan 2017
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Online Access:http://eprints.utm.my/id/eprint/75638/1/NurWarissyahidahBadrulHisham_ThermalPerformanceAnalysisforOptimal.pdf
http://eprints.utm.my/id/eprint/75638/
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85020235901&doi=10.12928%2fTELKOMNIKA.v15i2.6140&partnerID=40&md5=4a6bc8be7d08037ce19c9a6794d897e6
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Institution: Universiti Teknologi Malaysia
Language: English

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http://eprints.utm.my/id/eprint/75638/1/NurWarissyahidahBadrulHisham_ThermalPerformanceAnalysisforOptimal.pdf
http://eprints.utm.my/id/eprint/75638/
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85020235901&doi=10.12928%2fTELKOMNIKA.v15i2.6140&partnerID=40&md5=4a6bc8be7d08037ce19c9a6794d897e6

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