Thermal performance analysis for optimal passive cooling heat sink design

• Main Authors: Hisham, N. W. B., Ismail, F. S., Nawawi, M. A. A.
• Format: Article
• Language: English
• Published: Universitas Ahmad Dahlan 2017
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utm.my/id/eprint/75638/1/NurWarissyahidahBadrulHisham_ThermalPerformanceAnalysisforOptimal.pdf; http://eprints.utm.my/id/eprint/75638/; https://www.scopus.com/inward/record.uri?eid=2-s2.0-85020235901&doi=10.12928%2fTELKOMNIKA.v15i2.6140&partnerID=40&md5=4a6bc8be7d08037ce19c9a6794d897e6
• Institution: Universiti Teknologi Malaysia

Recent advances in semiconductor technology show the improvement of fabrication on electronics appliances in terms of performance, power density and even the size. This great achievement however led to some major problems on thermal and heat distribution of the electronic devices. This thermal probl...