Thermomigration in lead-free solder joints
In the next generation nanoelectronics and SiC based electronic packaging, current density and temperature gradient will be larger in orders of magnitude. Electromigration and thermomigration are considered to be major road blocks leading to realisation of nanoelectronics and SiC based high tempera...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Inderscience Publishers
2008
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/8493/ http://dx.doi.org/10.1504/IJMSI.2008.018898 |
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| Institution: | Universiti Teknologi Malaysia |