Deformation mechanism and enhanced properties of Cu–TiB2 composites evaluated by the in-situ tensile test and microstructure characterization

• Main Authors: Bahador, Abdollah, Junko, Umeda, Yamanoglu, Ridvan, Ghandvar, Hamidreza, Issariyapat, Ammarueda, Abu Bakar, Tuty Asma, Katsuyoshi, Kondoh
• Format: Article
• Published: Elsevier Ltd 2020
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/91367/; http://dx.doi.org/10.1016/j.jallcom.2020.156555
• Institution: Universiti Teknologi Malaysia

The demand for using high-performance Cu matrix composites in the electronic industry has recently increased rapidly owing to the low strength and tribological properties of pure copper. Accordingly, research and development of composite processing and related properties have increased. In this stud...