Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH
This research proposed intermediate materials between Cu filler and Si wafer to reduce the coefficient of thermal expansion (CTE) mismatch in the through silicon via (TSV) structure. The proposed material is Ni underlayer because it has CTE value between Cu and SiO2 which is 13 ppm/°C (Cu = 17 ppm/°...
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my.utm.933122021-11-19T03:15:37Z http://eprints.utm.my/id/eprint/93312/ Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH Anuar, M. A. N. Mohd. Amin, N. L. Fadil, N. A. TJ Mechanical engineering and machinery This research proposed intermediate materials between Cu filler and Si wafer to reduce the coefficient of thermal expansion (CTE) mismatch in the through silicon via (TSV) structure. The proposed material is Ni underlayer because it has CTE value between Cu and SiO2 which is 13 ppm/°C (Cu = 17 ppm/°C, SiO2 = 0.6 ppm/°C). The deposition process of nickel underlayer was conducted using electroless deposition process at various pH value (4.5, 5.5 and 6.5) of plating bath and deposition time (20, 40 and 60 minutes). The deposition behaviour was studied through surface and cross-sectional analysis under scanning electron microscopy (SEM). The Ni thickness was measured using cross-sectional analysis under SEM. The chemical composition of Ni deposits was measured using energy dispersive spectroscopy equipped on SEM. The performance test analysis was conducted using Standard ASTM D3359 (Cross Hatch Tape-Test) for coating adhesion test and 4-Point Probe Test for resistivity measurement. It was found that the optimum pH of the Ni bath is 6.5 due to high stability of plating bath to form uniform Ni deposited on silicon wafer. These optimum coating parameters showed homogeneous and uniform distribution of Nickel deposited on the surface of silicon with excellent adhesion properties for all pH value. Taylor and Francis Ltd. 2021 Article PeerReviewed Anuar, M. A. N. and Mohd. Amin, N. L. and Fadil, N. A. (2021) Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH. Advances in Materials and Processing Technologies, 7 (1). pp. 117-125. ISSN 2374-068X http://dx.doi.org/10.1080/2374068X.2020.1754741 DOI: 10.1080/2374068X.2020.1754741 |
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TJ Mechanical engineering and machinery Anuar, M. A. N. Mohd. Amin, N. L. Fadil, N. A. Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH |
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This research proposed intermediate materials between Cu filler and Si wafer to reduce the coefficient of thermal expansion (CTE) mismatch in the through silicon via (TSV) structure. The proposed material is Ni underlayer because it has CTE value between Cu and SiO2 which is 13 ppm/°C (Cu = 17 ppm/°C, SiO2 = 0.6 ppm/°C). The deposition process of nickel underlayer was conducted using electroless deposition process at various pH value (4.5, 5.5 and 6.5) of plating bath and deposition time (20, 40 and 60 minutes). The deposition behaviour was studied through surface and cross-sectional analysis under scanning electron microscopy (SEM). The Ni thickness was measured using cross-sectional analysis under SEM. The chemical composition of Ni deposits was measured using energy dispersive spectroscopy equipped on SEM. The performance test analysis was conducted using Standard ASTM D3359 (Cross Hatch Tape-Test) for coating adhesion test and 4-Point Probe Test for resistivity measurement. It was found that the optimum pH of the Ni bath is 6.5 due to high stability of plating bath to form uniform Ni deposited on silicon wafer. These optimum coating parameters showed homogeneous and uniform distribution of Nickel deposited on the surface of silicon with excellent adhesion properties for all pH value. |
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Article |
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Anuar, M. A. N. Mohd. Amin, N. L. Fadil, N. A. |
author_facet |
Anuar, M. A. N. Mohd. Amin, N. L. Fadil, N. A. |
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Anuar, M. A. N. |
title |
Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH |
title_short |
Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH |
title_full |
Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH |
title_fullStr |
Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH |
title_full_unstemmed |
Electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath pH |
title_sort |
electroless nickel underlayer deposited between copper filler and silicon substrate: effect of bath ph |
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Taylor and Francis Ltd. |
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2021 |
url |
http://eprints.utm.my/id/eprint/93312/ http://dx.doi.org/10.1080/2374068X.2020.1754741 |
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