A systematic review of deep learning for silicon wafer defect recognition

Advancements in technology have made deep learning a hot research area, and we see its applications in various fields. Its widespread use in silicon wafer defect recognition is replacing traditional machine learning and image processing methods of defect monitoring. This article presents a review of...

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Main Authors: Batool, U., Shapiai, M. I., Tahir, M., Ismail, Z. H., Zakaria, N. J., Elfakharany, A.
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers Inc. 2021
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Online Access:http://eprints.utm.my/id/eprint/95105/1/UzmaBatool2021_ASystematicReviewofDeepLearning.pdf
http://eprints.utm.my/id/eprint/95105/
http://dx.doi.org/10.1109/ACCESS.2021.3106171
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Institution: Universiti Teknologi Malaysia
Language: English
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spelling my.utm.951052022-04-29T22:02:20Z http://eprints.utm.my/id/eprint/95105/ A systematic review of deep learning for silicon wafer defect recognition Batool, U. Shapiai, M. I. Tahir, M. Ismail, Z. H. Zakaria, N. J. Elfakharany, A. TP Chemical technology Advancements in technology have made deep learning a hot research area, and we see its applications in various fields. Its widespread use in silicon wafer defect recognition is replacing traditional machine learning and image processing methods of defect monitoring. This article presents a review of the deep learning methods employed for wafer map defect recognition. A systematic literature review (SLR)has been conducted to determine how the semiconductor industry is being leveraged by advancements in deep learning research for wafer defects recognition and analysis. Forty-four articles from the well-known databases have been selected for this review. The detailed study of the selected articles identified the prominent deep learning algorithms and network architectures for wafer map defect classification, clustering, feature extraction, and data synthesis. The learning algorithms are grouped as supervised learning, unsupervised learning, and hybrid learning. The network architectures include different forms of Convolutional Neural Network (CNN), Generative Adversarial Network (GAN), and (Auto-encoder (AE). Issues of multi-class and multi-label defects have been addressed, solving data unavailability, class imbalance, instance labeling, and unknown defects. As future directions, it is recommended to invest more efforts in the accuracy of the data generation procedures and the defect pattern recognition frameworks for defect monitoring in real industrial environments. Institute of Electrical and Electronics Engineers Inc. 2021 Article PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/95105/1/UzmaBatool2021_ASystematicReviewofDeepLearning.pdf Batool, U. and Shapiai, M. I. and Tahir, M. and Ismail, Z. H. and Zakaria, N. J. and Elfakharany, A. (2021) A systematic review of deep learning for silicon wafer defect recognition. IEEE Access . ISSN 2169-3536 http://dx.doi.org/10.1109/ACCESS.2021.3106171 DOI: 10.1109/ACCESS.2021.3106171
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TP Chemical technology
spellingShingle TP Chemical technology
Batool, U.
Shapiai, M. I.
Tahir, M.
Ismail, Z. H.
Zakaria, N. J.
Elfakharany, A.
A systematic review of deep learning for silicon wafer defect recognition
description Advancements in technology have made deep learning a hot research area, and we see its applications in various fields. Its widespread use in silicon wafer defect recognition is replacing traditional machine learning and image processing methods of defect monitoring. This article presents a review of the deep learning methods employed for wafer map defect recognition. A systematic literature review (SLR)has been conducted to determine how the semiconductor industry is being leveraged by advancements in deep learning research for wafer defects recognition and analysis. Forty-four articles from the well-known databases have been selected for this review. The detailed study of the selected articles identified the prominent deep learning algorithms and network architectures for wafer map defect classification, clustering, feature extraction, and data synthesis. The learning algorithms are grouped as supervised learning, unsupervised learning, and hybrid learning. The network architectures include different forms of Convolutional Neural Network (CNN), Generative Adversarial Network (GAN), and (Auto-encoder (AE). Issues of multi-class and multi-label defects have been addressed, solving data unavailability, class imbalance, instance labeling, and unknown defects. As future directions, it is recommended to invest more efforts in the accuracy of the data generation procedures and the defect pattern recognition frameworks for defect monitoring in real industrial environments.
format Article
author Batool, U.
Shapiai, M. I.
Tahir, M.
Ismail, Z. H.
Zakaria, N. J.
Elfakharany, A.
author_facet Batool, U.
Shapiai, M. I.
Tahir, M.
Ismail, Z. H.
Zakaria, N. J.
Elfakharany, A.
author_sort Batool, U.
title A systematic review of deep learning for silicon wafer defect recognition
title_short A systematic review of deep learning for silicon wafer defect recognition
title_full A systematic review of deep learning for silicon wafer defect recognition
title_fullStr A systematic review of deep learning for silicon wafer defect recognition
title_full_unstemmed A systematic review of deep learning for silicon wafer defect recognition
title_sort systematic review of deep learning for silicon wafer defect recognition
publisher Institute of Electrical and Electronics Engineers Inc.
publishDate 2021
url http://eprints.utm.my/id/eprint/95105/1/UzmaBatool2021_ASystematicReviewofDeepLearning.pdf
http://eprints.utm.my/id/eprint/95105/
http://dx.doi.org/10.1109/ACCESS.2021.3106171
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