An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
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Universitat Politecnica de Catalunya
2019
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 http://eprints.utp.edu.my/25242/ |
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my.utp.eprints.252422021-08-27T09:05:36Z An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. Universitat Politecnica de Catalunya 2019 Article NonPeerReviewed https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 Hoe, H.K. and Prakash, J. and Kamaruddin, S. and Seng, O.K. (2019) An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study. Journal of Industrial Engineering and Management, 12 (2). pp. 340-355. http://eprints.utp.edu.my/25242/ |
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| format |
Article |
| author |
Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. |
| spellingShingle |
Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
| author_facet |
Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. |
| author_sort |
Hoe, H.K. |
| title |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
| title_short |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
| title_full |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
| title_fullStr |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
| title_full_unstemmed |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
| title_sort |
integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: a case study |
| publisher |
Universitat Politecnica de Catalunya |
| publishDate |
2019 |
| url |
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 http://eprints.utp.edu.my/25242/ |
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