Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites
Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu) reinfor...
Saved in:
Main Authors: | , , , , , |
---|---|
Format: | Conference or Workshop Item |
Published: |
EDP Sciences
2014
|
Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84905020743&doi=10.1051%2fmatecconf%2f20141304028&partnerID=40&md5=a9ff594fd39f194813493fc4a4b1ff78 http://eprints.utp.edu.my/32232/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Universiti Teknologi Petronas |