Evaluation of machine learning classifiers in faulty die prediction to maximize cost scrapping avoidance and assembly test capacity savings in semiconductor integrated circuit (IC) manufacturing

• Main Authors: Mohd Fazil, Azlan Faizal, Mohd Shaharanee, Izwan Nizal, Mohd Jamil, Jastini
• Format: Article
• Language: English
• Published: AIP Publishing LLC 2019
• Subjects: QA75 Electronic computers. Computer science
• Online Access: http://repo.uum.edu.my/27050/1/fazil2019.pdf; http://repo.uum.edu.my/27050/; http://doi.org/10.1063/1.5121089
• Institution: Universiti Utara Malaysia

Semiconductor manufacturing is a complex and expensive process. The semiconductor packaging trending towards for more complex package with higher performance and lower power consumption. The silicon die is manufactured using smaller fab process technology node and packaging technology is using more...