Silver metallization : stability and reliability

• Main Authors: Adams, Daniel, Alford, Terry L., Mayer, James W.
• Format: Book
• Language: English
• Published: Springer 2017
• Subjects: Chemistry; Materials Science ; Silver > Electrometallurgy ; Electrochemical metallizing ; Integrated circuits > Materials.; 669.23
• Online Access: http://repository.vnu.edu.vn/handle/VNU_123/29863
• Institution: Vietnam National University, Hanoi

"Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology." "Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization."--Jacket.