Solder Joint Reliability Prediction for Multiple Environments

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Format: Book
Published: Springer 2017
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Online Access:http://repository.vnu.edu.vn/handle/VNU_123/31606
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Institution: Vietnam National University, Hanoi
id oai:112.137.131.14:VNU_123-31606
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spelling oai:112.137.131.14:VNU_123-316062020-06-29T07:16:18Z Solder Joint Reliability Prediction for Multiple Environments Engineering 621.381046 22 2017-04-20T04:02:19Z 2017-04-20T04:02:19Z 2009 Book http://repository.vnu.edu.vn/handle/VNU_123/31606 application/pdf Springer
institution Vietnam National University, Hanoi
building VNU Library & Information Center
country Vietnam
collection VNU Digital Repository
topic Engineering
621.381046 22
spellingShingle Engineering
621.381046 22
Solder Joint Reliability Prediction for Multiple Environments
format Book
title Solder Joint Reliability Prediction for Multiple Environments
title_short Solder Joint Reliability Prediction for Multiple Environments
title_full Solder Joint Reliability Prediction for Multiple Environments
title_fullStr Solder Joint Reliability Prediction for Multiple Environments
title_full_unstemmed Solder Joint Reliability Prediction for Multiple Environments
title_sort solder joint reliability prediction for multiple environments
publisher Springer
publishDate 2017
url http://repository.vnu.edu.vn/handle/VNU_123/31606
_version_ 1680965397445083136