Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes
p. 413-430
Saved in:
| Main Authors: | , , |
|---|---|
| 格式: | Article |
| 語言: | English |
| 出版: |
ĐHQGHN
2017
|
| 主題: | |
| 在線閱讀: | http://repository.vnu.edu.vn/handle/VNU_123/58285 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | Vietnam National University, Hanoi |
| 語言: | English |
| id |
oai:112.137.131.14:VNU_123-58285 |
|---|---|
| record_format |
dspace |
| spelling |
oai:112.137.131.14:VNU_123-582852017-09-30T20:51:44Z Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes Yoshio Kobayashi Yusuke Yasuda Toshiaki Morita Cupper Nanoparticle Colloid Filler Metalemetal bonding p. 413-430 This review introduces our study on the development of Cu-based nanoparticles suitable as fillers in the metal-metal bonding process. Colloid solutions of various nanoparticles such as cuprous iodide, cupric oxide (CuO), CuO mixed with silver oxide (Ag2O/CuO), cuprous-oxide (Cu2O), metallic Cu, plolypyrrole-coated metallic Cu, and metallic Cu containing metallic Ag (Ag/Cu) were prepared by liquid phase processes such as reduction and a salt-base reaction. Metal-metal bonding properties of their powders were evaluated by sandwiching the particle powder between metallic discs, annealing them at a pressure of 1.2 MPa, and measuring the shear strength required for separating the bonded discs. Various particles (above-mentioned), various metallic discs (Cu, Ag, and Ni), various bonding temperatures (250-400 C), and different atmospheres in bonding (H2 and N2) were examined to find nanoparticle filler suitable for metal-metal bonding. As a result, it was confirmed that the metallic Cu, the CuO, the Ag2O/CuO, and the Ag/Cu particles were suitable for Cu-Cu bonding in H2, low-temperature Cu-Cu bonding in H2, Ag-Ag bonding in H2, and Cu-Cu bonding in N2, respectively. The metallic Cu particles also had functions of Ag-Ag and Ni-Ni bondings in H2. These results were explained with the particle size, the amount of impurity, and the d-value. 2017-08-24T08:43:46Z 2017-08-24T08:43:46Z 2016 Article 2468-2284 http://repository.vnu.edu.vn/handle/VNU_123/58285 en application/pdf ĐHQGHN |
| institution |
Vietnam National University, Hanoi |
| building |
VNU Library & Information Center |
| country |
Vietnam |
| collection |
VNU Digital Repository |
| language |
English |
| topic |
Cupper Nanoparticle Colloid Filler Metalemetal bonding |
| spellingShingle |
Cupper Nanoparticle Colloid Filler Metalemetal bonding Yoshio Kobayashi Yusuke Yasuda Toshiaki Morita Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes |
| description |
p. 413-430 |
| format |
Article |
| author |
Yoshio Kobayashi Yusuke Yasuda Toshiaki Morita |
| author_facet |
Yoshio Kobayashi Yusuke Yasuda Toshiaki Morita |
| author_sort |
Yoshio Kobayashi |
| title |
Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes |
| title_short |
Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes |
| title_full |
Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes |
| title_fullStr |
Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes |
| title_full_unstemmed |
Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes |
| title_sort |
recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes |
| publisher |
ĐHQGHN |
| publishDate |
2017 |
| url |
http://repository.vnu.edu.vn/handle/VNU_123/58285 |
| _version_ |
1680965277948313600 |