Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes

Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes

p. 413-430

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書目詳細資料
Main Authors:	Yoshio Kobayashi, Yusuke Yasuda, Toshiaki Morita
格式:	Article
語言:	English
出版:	ĐHQGHN 2017
主題:	Cupper Nanoparticle Colloid Filler Metalemetal bonding
在線閱讀:	http://repository.vnu.edu.vn/handle/VNU_123/58285
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	Vietnam National University, Hanoi
語言:	English

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