Recent advances in the synthesis of copper-based nanoparticles for metalemetal bonding processes

• Main Authors: Yoshio Kobayashi, Yusuke Yasuda, Toshiaki Morita
• 格式: Article
• 語言: English
• 出版: ĐHQGHN 2017
• 主題: Cupper; Nanoparticle; Colloid; Filler; Metalemetal bonding
• 在線閱讀: http://repository.vnu.edu.vn/handle/VNU_123/58285

p. 413-430