Very thin plastic packaging of wafer-level-capped MEMS device

• Main Author: Lacsamana, Elmer S.
• Format: text
• Language: English
• Published: Animo Repository 2006
• Subjects: Plastics in packaging; Microelectromechanical systems; Engineering
• Online Access: https://animorepository.dlsu.edu.ph/etd_masteral/3578; https://animorepository.dlsu.edu.ph/context/etd_masteral/article/10416/viewcontent/CDTG004377_P.pdf
• Institution: De La Salle University

Analog Devices Inc. (ADI) has been a major supplier of accelerometer devices in hermetic packages used for crash detection and vehicle dynamic control in the automotive industry. A major market pull from the handheld customers makes it imperative to develop very thin plastic packaging solution for MEMS accelerometer. This work details the development of a very thin plastic packaging solution for wafer- level-capped MEMS accelerometer device. A backgrinding process is developed to successfully thin the wafer-level-capped MEMS accele ocess demonstrated to successfully thin down to 250um thickness. Capped MEMS wafers are prepared for manufacturing by using wafer protective tapes, manufacturing concerns and corresponding solutions are discussed. A 4x4x1mm3 Leadframe Chip Scale Package (LFCSP) is pr he thinned MEMS device. The performance of the thinned a e using the very thin packaging s l t d significant effect in performance is observed. An analytical m uations [14] is used to further under of very thin plastic packaging on thin MEMS accelerometer device.