CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
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| Format: | Final Year Project |
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2024
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| Online Access: | http://utpedia.utp.edu.my/id/eprint/28822/ |
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| Institution: | Universiti Teknologi Petronas |
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oai:utpedia.utp.edu.my:288222024-08-19T02:25:47Z http://utpedia.utp.edu.my/id/eprint/28822/ CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. Mohd Hanif, Muhammad Zharif Mifdhal TJ Mechanical engineering and machinery 2024-01 Final Year Project NonPeerReviewed Mohd Hanif, Muhammad Zharif Mifdhal (2024) CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. [Final Year Project] (Submitted) |
| institution |
Universiti Teknologi Petronas |
| building |
UTP Resource Centre |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Teknologi Petronas |
| content_source |
UTP Electronic and Digitized Intellectual Asset |
| url_provider |
http://utpedia.utp.edu.my/ |
| topic |
TJ Mechanical engineering and machinery |
| spellingShingle |
TJ Mechanical engineering and machinery Mohd Hanif, Muhammad Zharif Mifdhal CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. |
| format |
Final Year Project |
| author |
Mohd Hanif, Muhammad Zharif Mifdhal |
| author_facet |
Mohd Hanif, Muhammad Zharif Mifdhal |
| author_sort |
Mohd Hanif, Muhammad Zharif Mifdhal |
| title |
CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. |
| title_short |
CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. |
| title_full |
CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. |
| title_fullStr |
CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. |
| title_full_unstemmed |
CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. |
| title_sort |
cfd modelling of heat sinks thermal boundary layer effect on cooling of electronic components. |
| publishDate |
2024 |
| url |
http://utpedia.utp.edu.my/id/eprint/28822/ |
| _version_ |
1808972444122218496 |