CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.

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Bibliographic Details
Main Author:	Mohd Hanif, Muhammad Zharif Mifdhal
Format:	Final Year Project
Published:	2024
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://utpedia.utp.edu.my/id/eprint/28822/
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Institution:	Universiti Teknologi Petronas

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