Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack
We have studied the drain current dispersion characteristics of conventional AlGaN/GaN HEMTs and SiN/Al2O3/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MISHEMT) fabricated on silicon substrate. The fabricated MISHEMT exhibited an IDmaxof >1000 mA/mm and gmmax of 241...
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sg-ntu-dr.10356-1004842020-03-07T12:47:08Z Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack Anand, M. J. Ng, G. I. Vicknesh, S. Arulkumaran, Subramaniam Ranjan, K. School of Electrical and Electronic Engineering Research Techno Plaza Temasek Laboratories DRNTU::Engineering::Electrical and electronic engineering::Electric power We have studied the drain current dispersion characteristics of conventional AlGaN/GaN HEMTs and SiN/Al2O3/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MISHEMT) fabricated on silicon substrate. The fabricated MISHEMT exhibited an IDmaxof >1000 mA/mm and gmmax of 241 mS/mm. Compared to conventional AlGaN/GaN HEMTs, about an order of magnitude lower gate leakage current and a ∼ 60% reduction in drain current (ID) collapse was observed in the MISHEMTs. The observation of low ID collapse is due to the occurrence of low interface state density (6.39 × 1010 eV-1 cm-2) between the bilayer dielectric (SiN/Al2O3) and GaN surface which is confirmed through the AC-conductance method. 2014-10-24T07:29:23Z 2019-12-06T20:23:18Z 2014-10-24T07:29:23Z 2019-12-06T20:23:18Z 2013 2013 Journal Article Anand, M. J., Ng, G. I., Vicknesh, S., Arulkumaran, S., & Ranjan, K. (2013). Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack. Physica status solidi (c), 10(11), 1421-1425. 1862-6351 https://hdl.handle.net/10356/100484 http://hdl.handle.net/10220/24127 10.1002/pssc.201300219 en Physica status solidi (c) © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. |
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DRNTU::Engineering::Electrical and electronic engineering::Electric power Anand, M. J. Ng, G. I. Vicknesh, S. Arulkumaran, Subramaniam Ranjan, K. Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack |
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We have studied the drain current dispersion characteristics of conventional AlGaN/GaN HEMTs and SiN/Al2O3/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MISHEMT) fabricated on silicon substrate. The fabricated MISHEMT exhibited an IDmaxof >1000 mA/mm and gmmax of 241 mS/mm. Compared to conventional AlGaN/GaN HEMTs, about an order of magnitude lower gate leakage current and a ∼ 60% reduction in drain current (ID) collapse was observed in the MISHEMTs. The observation of low ID collapse is due to the occurrence of low interface state density (6.39 × 1010 eV-1 cm-2) between the bilayer dielectric (SiN/Al2O3) and GaN surface which is confirmed through the AC-conductance method. |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering Anand, M. J. Ng, G. I. Vicknesh, S. Arulkumaran, Subramaniam Ranjan, K. |
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Article |
author |
Anand, M. J. Ng, G. I. Vicknesh, S. Arulkumaran, Subramaniam Ranjan, K. |
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Anand, M. J. |
title |
Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack |
title_short |
Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack |
title_full |
Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack |
title_fullStr |
Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack |
title_full_unstemmed |
Reduction of current collapse in AlGaN/GaN MISHEMT with bilayer SiN/Al2O3 dielectric gate stack |
title_sort |
reduction of current collapse in algan/gan mishemt with bilayer sin/al2o3 dielectric gate stack |
publishDate |
2014 |
url |
https://hdl.handle.net/10356/100484 http://hdl.handle.net/10220/24127 |
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1681038866006409216 |