Orthogonal microcutting of thin workpieces

With a broader intention of producing thin sheet embossing molds, orthogonal cutting experiments of thin workpieces are conducted. Challenges in machining thin workpieces are many: machining induced stress and deformation, fixturing challenges, and substrate effects. A setup involving continuous ort...

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Main Authors: Kushendarsyah, Saptaji, Sathyan, Subbiah
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2014
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Online Access:https://hdl.handle.net/10356/100533
http://hdl.handle.net/10220/24101
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1005332020-03-07T13:22:13Z Orthogonal microcutting of thin workpieces Kushendarsyah, Saptaji Sathyan, Subbiah School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing::Product engineering With a broader intention of producing thin sheet embossing molds, orthogonal cutting experiments of thin workpieces are conducted. Challenges in machining thin workpieces are many: machining induced stress and deformation, fixturing challenges, and substrate effects. A setup involving continuous orthogonal cutting with a single crystal diamond toolof an aluminum alloy (Al6061-T6) workpiece fixtured using an adhesive to reduce its thickness is used to study trends in forces, chip thickness, and to understand to what level of thickness we can machine the workpiece down to and in what form the adhesive fails. There are no significant changes observed in the forces and chip thickness between thick and thin workpieces during the experiments, meaning that the cutting energy required is the same in cutting thick or thin workpieces. The limitation to achieve thinner workpiece is attributed mainly due to the detachment of the thin workpiece by peel-off induced by adhesive failure mode, which occurs during initial chip formation as the tool initially engages with the workpiece. We use a finite element model to understand the stresses in the workpiece during this initial tool engagement when it is thick and when it is thin, as well as the effect of the adhesive itself and the effect of adhesive thickness. Simulation results show that the tensile stress induced by the tool at the workpiece-adhesive interface is higher for a thinner workpiece (45 µm) than a thicker workpiece (150 µm) and higher at the entrance. As such, a thinner workpiece is more susceptible to peel-off. The peeling of thin workpiece is induced when the high tensile stress at the interface exceeds the tensile-at-break value of the adhesive. 2014-10-21T09:04:26Z 2019-12-06T20:24:06Z 2014-10-21T09:04:26Z 2019-12-06T20:24:06Z 2013 2013 Journal Article Kushendarsyah, S., & Sathyan, S. (2013). Orthogonal microcutting of thin workpieces. Journal of manufacturing science and engineering, 135(3), 031004-. 1087-1357 https://hdl.handle.net/10356/100533 http://hdl.handle.net/10220/24101 10.1115/1.4023710 en Journal of manufacturing science and engineering © 2013 ASME.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Manufacturing::Product engineering
spellingShingle DRNTU::Engineering::Manufacturing::Product engineering
Kushendarsyah, Saptaji
Sathyan, Subbiah
Orthogonal microcutting of thin workpieces
description With a broader intention of producing thin sheet embossing molds, orthogonal cutting experiments of thin workpieces are conducted. Challenges in machining thin workpieces are many: machining induced stress and deformation, fixturing challenges, and substrate effects. A setup involving continuous orthogonal cutting with a single crystal diamond toolof an aluminum alloy (Al6061-T6) workpiece fixtured using an adhesive to reduce its thickness is used to study trends in forces, chip thickness, and to understand to what level of thickness we can machine the workpiece down to and in what form the adhesive fails. There are no significant changes observed in the forces and chip thickness between thick and thin workpieces during the experiments, meaning that the cutting energy required is the same in cutting thick or thin workpieces. The limitation to achieve thinner workpiece is attributed mainly due to the detachment of the thin workpiece by peel-off induced by adhesive failure mode, which occurs during initial chip formation as the tool initially engages with the workpiece. We use a finite element model to understand the stresses in the workpiece during this initial tool engagement when it is thick and when it is thin, as well as the effect of the adhesive itself and the effect of adhesive thickness. Simulation results show that the tensile stress induced by the tool at the workpiece-adhesive interface is higher for a thinner workpiece (45 µm) than a thicker workpiece (150 µm) and higher at the entrance. As such, a thinner workpiece is more susceptible to peel-off. The peeling of thin workpiece is induced when the high tensile stress at the interface exceeds the tensile-at-break value of the adhesive.
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Kushendarsyah, Saptaji
Sathyan, Subbiah
format Article
author Kushendarsyah, Saptaji
Sathyan, Subbiah
author_sort Kushendarsyah, Saptaji
title Orthogonal microcutting of thin workpieces
title_short Orthogonal microcutting of thin workpieces
title_full Orthogonal microcutting of thin workpieces
title_fullStr Orthogonal microcutting of thin workpieces
title_full_unstemmed Orthogonal microcutting of thin workpieces
title_sort orthogonal microcutting of thin workpieces
publishDate 2014
url https://hdl.handle.net/10356/100533
http://hdl.handle.net/10220/24101
_version_ 1681043853867483136