Reliable 3-D clock-tree synthesis considering nonlinear capacitive TSV model with electrical–thermal–mechanical coupling
A robust physical design of 3-D IC requires investigation on through-silicon via (TSV). The large temperatures and stress gradients can severely affect TSV delay with large variation. The traditional physical model treats TSV as a resistor with linear electrical-thermal dependence, which ignores the...
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Main Authors: | , , , , |
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Other Authors: | |
Format: | Article |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/100898 http://hdl.handle.net/10220/18217 |
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Institution: | Nanyang Technological University |
Language: | English |