Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model
3D physical design needs accurate device model of through-silicon vias (TSVs). In this paper, physics-based electrical-thermal model is introduced for both signal and dummy thermal TSVs with the consideration of nonlinear electrical-thermal dependence. Taking thermal-reliable 3D clock-tree synthesis...
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Main Authors: | , , , , , |
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其他作者: | |
格式: | Conference or Workshop Item |
語言: | English |
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2013
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主題: | |
在線閱讀: | https://hdl.handle.net/10356/96541 http://hdl.handle.net/10220/17271 |
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機構: | Nanyang Technological University |
語言: | English |