Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model

• Main Authors: Shang, Yang, Zhang, Chun, Yu, Hao, Tan, Chuan Seng, Zhao, Xin, Lim, Sung Kyu
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/96541; http://hdl.handle.net/10220/17271
• Institution: Nanyang Technological University

3D physical design needs accurate device model of through-silicon vias (TSVs). In this paper, physics-based electrical-thermal model is introduced for both signal and dummy thermal TSVs with the consideration of nonlinear electrical-thermal dependence. Taking thermal-reliable 3D clock-tree synthesis...