Thermal – Mechanical – Electrical relationship modeling on TSV
This project study the relationship of thermal, mechanical and electrical properties relationship on the TSV, one of the method to do interconnection on 3D IC. 3D IC is an emerging technology and has the potential to be the solution to 2D IC limitation.
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Format: | Final Year Project |
Language: | English |
Published: |
2013
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Online Access: | http://hdl.handle.net/10356/51060 |
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Institution: | Nanyang Technological University |
Language: | English |