Thermal – Mechanical – Electrical relationship modeling on TSV

• Main Author: Arvin Eka Nata.
• Other Authors: Chang Chip Hong
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• Online Access: http://hdl.handle.net/10356/51060
• Institution: Nanyang Technological University

This project study the relationship of thermal, mechanical and electrical properties relationship on the TSV, one of the method to do interconnection on 3D IC. 3D IC is an emerging technology and has the potential to be the solution to 2D IC limitation.