Thermal – Mechanical – Electrical relationship modeling on TSV
This project study the relationship of thermal, mechanical and electrical properties relationship on the TSV, one of the method to do interconnection on 3D IC. 3D IC is an emerging technology and has the potential to be the solution to 2D IC limitation.
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| Format: | Final Year Project |
| Language: | English |
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2013
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| Online Access: | http://hdl.handle.net/10356/51060 |
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| Institution: | Nanyang Technological University |
| Language: | English |
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sg-ntu-dr.10356-510602023-07-07T17:18:28Z Thermal – Mechanical – Electrical relationship modeling on TSV Arvin Eka Nata. Chang Chip Hong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits This project study the relationship of thermal, mechanical and electrical properties relationship on the TSV, one of the method to do interconnection on 3D IC. 3D IC is an emerging technology and has the potential to be the solution to 2D IC limitation. Bachelor of Engineering 2013-01-03T04:25:32Z 2013-01-03T04:25:32Z 2012 2012 Final Year Project (FYP) http://hdl.handle.net/10356/51060 en Nanyang Technological University 19 p. application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| language |
English |
| topic |
DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits |
| spellingShingle |
DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits Arvin Eka Nata. Thermal – Mechanical – Electrical relationship modeling on TSV |
| description |
This project study the relationship of thermal, mechanical and electrical properties relationship on the TSV, one of the method to do interconnection on 3D IC. 3D IC is an emerging technology and has the potential to be the solution to 2D IC limitation. |
| author2 |
Chang Chip Hong |
| author_facet |
Chang Chip Hong Arvin Eka Nata. |
| format |
Final Year Project |
| author |
Arvin Eka Nata. |
| author_sort |
Arvin Eka Nata. |
| title |
Thermal – Mechanical – Electrical relationship modeling on TSV |
| title_short |
Thermal – Mechanical – Electrical relationship modeling on TSV |
| title_full |
Thermal – Mechanical – Electrical relationship modeling on TSV |
| title_fullStr |
Thermal – Mechanical – Electrical relationship modeling on TSV |
| title_full_unstemmed |
Thermal – Mechanical – Electrical relationship modeling on TSV |
| title_sort |
thermal – mechanical – electrical relationship modeling on tsv |
| publishDate |
2013 |
| url |
http://hdl.handle.net/10356/51060 |
| _version_ |
1772828673752170496 |