In-situ measurement of the stiffness of the foam layer in foam-adhesive bonded structures

• Main Authors: Qin, S., Shang, H. M., Fu, Yu, Lam, Yee Cheong
• 其他作者: International Conference on Experimental Mechanics : Advances and Applications (1997 : Singapore)
• 格式: Conference or Workshop Item
• 語言: English
• 出版: 2010
• 主題: DRNTU::Engineering::Aeronautical engineering::Materials of construction
• 在線閱讀: https://hdl.handle.net/10356/101391; http://hdl.handle.net/10220/6478
• 機構: Nanyang Technological University

Foam-adhesive bonding is a common fabrication process in the aerospace, the automobile and the electronic industry. During service, the change with time in the behavior of components fabricated by this process is often caused by degradation of the foam layer within. As it is impractical, and at time...