Effects of temperature and voids on the interfacial fracture of Si/a-Si3 N4 bilayer systems

• Main Authors: Lin, Pamela, Babicheva, Rita I., Xue, Ming, Zhang, Hai Shu, Xu, Huan, Liu, Bo, Zhou, Kun
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2015
• Subjects: DRNTU::Science::Chemistry::Physical chemistry::Molecular structure and bonding
• Online Access: https://hdl.handle.net/10356/103431; http://hdl.handle.net/10220/25836
• Institution: Nanyang Technological University

This work studies the effects of temperature, voids at or near the interface on the interfacial fracture behavior, and mechanisms of the Si/a-Si3N4 bilayer systems via molecular dynamics simulations. Under mode I loading, at 300 K, the interfacial strength of the bilayer system without voids is ∼22....