Indentation damage evaluation on metal-coated thin-films stacked structure
A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading–unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposi...
Saved in:
Main Authors: | , , |
---|---|
Other Authors: | |
Format: | Article |
Language: | English |
Published: |
2015
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/104291 http://hdl.handle.net/10220/38823 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
id |
sg-ntu-dr.10356-104291 |
---|---|
record_format |
dspace |
spelling |
sg-ntu-dr.10356-1042912023-03-04T17:20:40Z Indentation damage evaluation on metal-coated thin-films stacked structure Yeo, Alfred Liu, Mao Zhou, Kun School of Mechanical and Aerospace Engineering Acoustic emission Indentation damage Coating Dielectric A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading–unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposited over the dielectric layers (SiO2 or Si3N4) on the Si substrate. The 1st AE event detected during the loading stage corresponded to the ‘pop-in’ observation in the force–displacement curve, which was related to the brittle cracking in the dielectric or Si substrate. However, during unloading, a 2nd AE event was detected, but no “pop-out” was observed, which was mainly due to the delamination between the dielectric and Si substrate. It was also found that for Si die, “pop-out” was observed without any AE event during the unloading stage, which was related to the Si phase transformation. This observation is unique to sharp indenter tip but not for a blunt indenter tip. Published version 2015-10-21T07:45:42Z 2019-12-06T21:29:57Z 2015-10-21T07:45:42Z 2019-12-06T21:29:57Z 2015 2015 Journal Article Yeo, A., Liu, M., & Zhou, K. Indentation damage evaluation on metal-coated thin-films stacked structure. Journal of Materials Research, 30(20), 3071-3083. https://hdl.handle.net/10356/104291 http://hdl.handle.net/10220/38823 10.1557/jmr.2015.278 en Journal of Materials Research © 2015 Materials Research Society. This paper was published in Journal of Materials Research and is made available as an electronic reprint (preprint) with permission of Materials Research Society. The published version is available at: [http://dx.doi.org/10.1557/jmr.2015.278]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. application/pdf |
institution |
Nanyang Technological University |
building |
NTU Library |
continent |
Asia |
country |
Singapore Singapore |
content_provider |
NTU Library |
collection |
DR-NTU |
language |
English |
topic |
Acoustic emission Indentation damage Coating Dielectric |
spellingShingle |
Acoustic emission Indentation damage Coating Dielectric Yeo, Alfred Liu, Mao Zhou, Kun Indentation damage evaluation on metal-coated thin-films stacked structure |
description |
A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading–unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposited over the dielectric layers (SiO2 or Si3N4) on the Si substrate. The 1st AE event detected during the loading stage corresponded to the ‘pop-in’ observation in the force–displacement curve, which was related to the brittle cracking in the dielectric or Si substrate. However, during unloading, a 2nd AE event was detected, but no “pop-out” was observed, which was mainly due to the delamination between the dielectric and Si substrate. It was also found that for Si die, “pop-out” was observed without any AE event during the unloading stage, which was related to the Si phase transformation. This observation is unique to sharp indenter tip but not for a blunt indenter tip. |
author2 |
School of Mechanical and Aerospace Engineering |
author_facet |
School of Mechanical and Aerospace Engineering Yeo, Alfred Liu, Mao Zhou, Kun |
format |
Article |
author |
Yeo, Alfred Liu, Mao Zhou, Kun |
author_sort |
Yeo, Alfred |
title |
Indentation damage evaluation on metal-coated thin-films stacked structure |
title_short |
Indentation damage evaluation on metal-coated thin-films stacked structure |
title_full |
Indentation damage evaluation on metal-coated thin-films stacked structure |
title_fullStr |
Indentation damage evaluation on metal-coated thin-films stacked structure |
title_full_unstemmed |
Indentation damage evaluation on metal-coated thin-films stacked structure |
title_sort |
indentation damage evaluation on metal-coated thin-films stacked structure |
publishDate |
2015 |
url |
https://hdl.handle.net/10356/104291 http://hdl.handle.net/10220/38823 |
_version_ |
1759855904087343104 |