Indentation damage evaluation on metal-coated thin-films stacked structure

A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading–unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposi...

Full description

Saved in:
Bibliographic Details
Main Authors: Yeo, Alfred, Liu, Mao, Zhou, Kun
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2015
Subjects:
Online Access:https://hdl.handle.net/10356/104291
http://hdl.handle.net/10220/38823
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-104291
record_format dspace
spelling sg-ntu-dr.10356-1042912023-03-04T17:20:40Z Indentation damage evaluation on metal-coated thin-films stacked structure Yeo, Alfred Liu, Mao Zhou, Kun School of Mechanical and Aerospace Engineering Acoustic emission Indentation damage Coating Dielectric A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading–unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposited over the dielectric layers (SiO2 or Si3N4) on the Si substrate. The 1st AE event detected during the loading stage corresponded to the ‘pop-in’ observation in the force–displacement curve, which was related to the brittle cracking in the dielectric or Si substrate. However, during unloading, a 2nd AE event was detected, but no “pop-out” was observed, which was mainly due to the delamination between the dielectric and Si substrate. It was also found that for Si die, “pop-out” was observed without any AE event during the unloading stage, which was related to the Si phase transformation. This observation is unique to sharp indenter tip but not for a blunt indenter tip. Published version 2015-10-21T07:45:42Z 2019-12-06T21:29:57Z 2015-10-21T07:45:42Z 2019-12-06T21:29:57Z 2015 2015 Journal Article Yeo, A., Liu, M., & Zhou, K. Indentation damage evaluation on metal-coated thin-films stacked structure. Journal of Materials Research, 30(20), 3071-3083. https://hdl.handle.net/10356/104291 http://hdl.handle.net/10220/38823 10.1557/jmr.2015.278 en Journal of Materials Research © 2015 Materials Research Society. This paper was published in Journal of Materials Research and is made available as an electronic reprint (preprint) with permission of Materials Research Society. The published version is available at: [http://dx.doi.org/10.1557/jmr.2015.278]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Acoustic emission
Indentation damage
Coating
Dielectric
spellingShingle Acoustic emission
Indentation damage
Coating
Dielectric
Yeo, Alfred
Liu, Mao
Zhou, Kun
Indentation damage evaluation on metal-coated thin-films stacked structure
description A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading–unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposited over the dielectric layers (SiO2 or Si3N4) on the Si substrate. The 1st AE event detected during the loading stage corresponded to the ‘pop-in’ observation in the force–displacement curve, which was related to the brittle cracking in the dielectric or Si substrate. However, during unloading, a 2nd AE event was detected, but no “pop-out” was observed, which was mainly due to the delamination between the dielectric and Si substrate. It was also found that for Si die, “pop-out” was observed without any AE event during the unloading stage, which was related to the Si phase transformation. This observation is unique to sharp indenter tip but not for a blunt indenter tip.
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Yeo, Alfred
Liu, Mao
Zhou, Kun
format Article
author Yeo, Alfred
Liu, Mao
Zhou, Kun
author_sort Yeo, Alfred
title Indentation damage evaluation on metal-coated thin-films stacked structure
title_short Indentation damage evaluation on metal-coated thin-films stacked structure
title_full Indentation damage evaluation on metal-coated thin-films stacked structure
title_fullStr Indentation damage evaluation on metal-coated thin-films stacked structure
title_full_unstemmed Indentation damage evaluation on metal-coated thin-films stacked structure
title_sort indentation damage evaluation on metal-coated thin-films stacked structure
publishDate 2015
url https://hdl.handle.net/10356/104291
http://hdl.handle.net/10220/38823
_version_ 1759855904087343104