Configurable three-dimensional boron nitride-carbon architecture and its tunable electronic behavior with stable thermal performances

Configurable three-dimensional boron nitride-carbon architecture and its tunable electronic behavior with stable thermal performances

Recent developments of 3D-graphene and 3D-boron-nitride have become of great interest owing to their potential for ultra-light flexible electronics. Here we demonstrate the first synthesis of novel 3D-BNC hybrids. By specifically controlling the compositions of C and BN, new fascinating properties a...

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Bibliographic Details
Main Authors: Loeblein, Manuela, Tay, Roland Yingjie, Tsang, Siu Hon, Ng, Wei Beng, Teo, Edwin Hang Tong
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2014
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:https://hdl.handle.net/10356/105204
http://hdl.handle.net/10220/20478
http://dx.doi.org/10.1002/smll.201400292
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Institution: Nanyang Technological University
Language: English
Description
Summary:Recent developments of 3D-graphene and 3D-boron-nitride have become of great interest owing to their potential for ultra-light flexible electronics. Here we demonstrate the first synthesis of novel 3D-BNC hybrids. By specifically controlling the compositions of C and BN, new fascinating properties are observed, such as highly tunable electrical conductivity, controllable EMI shielding properties, and stable thermal conductivity. This ultra-light hybrid opens up many new applications such as for electronic packaging and thermal interface materials (TIMs).

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