Configurable three-dimensional boron nitride-carbon architecture and its tunable electronic behavior with stable thermal performances

• Main Authors: Loeblein, Manuela, Tay, Roland Yingjie, Tsang, Siu Hon, Ng, Wei Beng, Teo, Edwin Hang Tong
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: https://hdl.handle.net/10356/105204; http://hdl.handle.net/10220/20478; http://dx.doi.org/10.1002/smll.201400292
• Institution: Nanyang Technological University

Recent developments of 3D-graphene and 3D-boron-nitride have become of great interest owing to their potential for ultra-light flexible electronics. Here we demonstrate the first synthesis of novel 3D-BNC hybrids. By specifically controlling the compositions of C and BN, new fascinating properties are observed, such as highly tunable electrical conductivity, controllable EMI shielding properties, and stable thermal conductivity. This ultra-light hybrid opens up many new applications such as for electronic packaging and thermal interface materials (TIMs).