Noncontact thickness measurement of Cu film on silicon wafer using magnetic resonance coupling for stress free polishing application

• Main Authors: Qu, Zilian, Wang, Wensong, Yang, Shuhui, Sun, Quqin, Fang, Zhongyuan, Zheng, Yuanjin
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2019
• Subjects: Double-coil Sensor; Magnetic Resonance Coupling; Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/107495; http://hdl.handle.net/10220/49705; http://dx.doi.org/10.1109/ACCESS.2019.2921005
• Institution: Nanyang Technological University

A novel noncontact measurement method based on double-coil sensor is proposed for determining the thickness of copper (Cu) film on the silicon wafer in the process of stress free polishing (SFP). The double-coil sensor consists of two identical coaxial eddy current coils and corresponding auxiliary...