Non-destructive evaluation of microelectronic components

Popcorn package cracking in plastic IC packaging can be classified into three types: Type I referring to failure originating from delamination between the mold compound and die pad interface, Type II originating from the die attach region, and Type in originating from the interface between the mold...

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Main Author: Chan, Kai Chong.
Other Authors: Wong, Brian Stephen
Format: Theses and Dissertations
Language:English
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/13437
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-134372023-03-11T17:28:49Z Non-destructive evaluation of microelectronic components Chan, Kai Chong. Wong, Brian Stephen School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing Popcorn package cracking in plastic IC packaging can be classified into three types: Type I referring to failure originating from delamination between the mold compound and die pad interface, Type II originating from the die attach region, and Type in originating from the interface between the mold compound and the silicon die. Recent advance in packaging design, process and materials such as mold compound have been effective in eliminating or reducing the occurrence of Type I and HI failures. However, Type II failures remain prevalent. The present work describes the results of a vigorous study to investigate the properties of various die attach materials that affect Type II popcorn cracking using a TQFP 208 package as a test vehicle. In addition, the work also reports the failure mechanism of Type II failure using SAM (scanning acoustic microscopy) as a failure analysis tool. Master of Science (Mechanical Engineering) 2008-09-01T01:06:07Z 2008-10-20T08:18:06Z 2008-09-01T01:06:07Z 2008-10-20T08:18:06Z 1998 1998 Thesis http://hdl.handle.net/10356/13437 en 189 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Chan, Kai Chong.
Non-destructive evaluation of microelectronic components
description Popcorn package cracking in plastic IC packaging can be classified into three types: Type I referring to failure originating from delamination between the mold compound and die pad interface, Type II originating from the die attach region, and Type in originating from the interface between the mold compound and the silicon die. Recent advance in packaging design, process and materials such as mold compound have been effective in eliminating or reducing the occurrence of Type I and HI failures. However, Type II failures remain prevalent. The present work describes the results of a vigorous study to investigate the properties of various die attach materials that affect Type II popcorn cracking using a TQFP 208 package as a test vehicle. In addition, the work also reports the failure mechanism of Type II failure using SAM (scanning acoustic microscopy) as a failure analysis tool.
author2 Wong, Brian Stephen
author_facet Wong, Brian Stephen
Chan, Kai Chong.
format Theses and Dissertations
author Chan, Kai Chong.
author_sort Chan, Kai Chong.
title Non-destructive evaluation of microelectronic components
title_short Non-destructive evaluation of microelectronic components
title_full Non-destructive evaluation of microelectronic components
title_fullStr Non-destructive evaluation of microelectronic components
title_full_unstemmed Non-destructive evaluation of microelectronic components
title_sort non-destructive evaluation of microelectronic components
publishDate 2008
url http://hdl.handle.net/10356/13437
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