To study and implement inkless binning : in semiconductor industry
This thesis introduces a wafer mapping based inkless binning process for wafer sorting to segregate and identify the electrical and functional good dies and reject dies and using the map to pick up the good dies in die attach operation in the semiconductor IC packaging industry.
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| Format: | Theses and Dissertations |
| Language: | English |
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2008
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| Online Access: | http://hdl.handle.net/10356/13444 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-134442023-03-11T16:56:33Z To study and implement inkless binning : in semiconductor industry Venkatachalam Valliappan Spedding, Trevor Allan School of Mechanical and Production Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging This thesis introduces a wafer mapping based inkless binning process for wafer sorting to segregate and identify the electrical and functional good dies and reject dies and using the map to pick up the good dies in die attach operation in the semiconductor IC packaging industry. Master of Science (Computer Integrated Manufacturing) 2008-10-20T08:18:21Z 2008-10-20T08:18:21Z 1999 1999 Thesis http://hdl.handle.net/10356/13444 en 69 p. application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| language |
English |
| topic |
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| spellingShingle |
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Venkatachalam Valliappan To study and implement inkless binning : in semiconductor industry |
| description |
This thesis introduces a wafer mapping based inkless binning process for wafer sorting to segregate and identify the electrical and functional good dies and reject dies and using the map to pick up the good dies in die attach operation in the semiconductor IC packaging industry. |
| author2 |
Spedding, Trevor Allan |
| author_facet |
Spedding, Trevor Allan Venkatachalam Valliappan |
| format |
Theses and Dissertations |
| author |
Venkatachalam Valliappan |
| author_sort |
Venkatachalam Valliappan |
| title |
To study and implement inkless binning : in semiconductor industry |
| title_short |
To study and implement inkless binning : in semiconductor industry |
| title_full |
To study and implement inkless binning : in semiconductor industry |
| title_fullStr |
To study and implement inkless binning : in semiconductor industry |
| title_full_unstemmed |
To study and implement inkless binning : in semiconductor industry |
| title_sort |
to study and implement inkless binning : in semiconductor industry |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/13444 |
| _version_ |
1761781843797999616 |