Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, p...
محفوظ في:
| المؤلف الرئيسي: | |
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| مؤلفون آخرون: | |
| التنسيق: | Theses and Dissertations |
| اللغة: | English |
| منشور في: |
2008
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://hdl.handle.net/10356/13489 |
| الوسوم: |
إضافة وسم
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| المؤسسة: | Nanyang Technological University |
| اللغة: | English |
| الملخص: | In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, poor soldering joints and unreliable leads connection. In practice, this proper preheat profile is achieved through a time consuming trial-and-error method and years of experience in wave soldering process control. |
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