Impact testing and analysis of adhesive bonds
The project attempts to develop an impact reliability testing analysis methodology for adhesive bonded joints used commonly in structural and electronic packaging applications. This is especially applicable to portable mechanical and electronic products that are prone to dropping from height and yet...
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| Language: | English |
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2008
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| Online Access: | http://hdl.handle.net/10356/13529 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-135292023-03-11T16:55:52Z Impact testing and analysis of adhesive bonds Cheng, Soon Kiong. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Material testing and characterization The project attempts to develop an impact reliability testing analysis methodology for adhesive bonded joints used commonly in structural and electronic packaging applications. This is especially applicable to portable mechanical and electronic products that are prone to dropping from height and yet expected to work reliably after dropping. Master of Science (Mechanics & Processing of Materials) 2008-09-01T01:44:56Z 2008-10-20T08:22:54Z 2008-09-01T01:44:56Z 2008-10-20T08:22:54Z 1998 1998 Thesis http://hdl.handle.net/10356/13529 en 40 p. application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| language |
English |
| topic |
DRNTU::Engineering::Materials::Material testing and characterization |
| spellingShingle |
DRNTU::Engineering::Materials::Material testing and characterization Cheng, Soon Kiong. Impact testing and analysis of adhesive bonds |
| description |
The project attempts to develop an impact reliability testing analysis methodology for adhesive bonded joints used commonly in structural and electronic packaging applications. This is especially applicable to portable mechanical and electronic products that are prone to dropping from height and yet expected to work reliably after dropping. |
| author2 |
Pang, John Hock Lye |
| author_facet |
Pang, John Hock Lye Cheng, Soon Kiong. |
| format |
Theses and Dissertations |
| author |
Cheng, Soon Kiong. |
| author_sort |
Cheng, Soon Kiong. |
| title |
Impact testing and analysis of adhesive bonds |
| title_short |
Impact testing and analysis of adhesive bonds |
| title_full |
Impact testing and analysis of adhesive bonds |
| title_fullStr |
Impact testing and analysis of adhesive bonds |
| title_full_unstemmed |
Impact testing and analysis of adhesive bonds |
| title_sort |
impact testing and analysis of adhesive bonds |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/13529 |
| _version_ |
1761781651274203136 |