Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning

Automatic optical inspection for manufacturing traditionally was based on computer vision. However, there are emerging attempts to do it using deep learning approach. Deep convolutional neural network allows to learn semantic image features which could be used for defect detection in products. In co...

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Main Authors: Volkau, Ihar, Abdul Mujeeb, Dai, Wenting, Erdt, Marius, Sourin, Alexei
Other Authors: School of Computer Science and Engineering
Format: Conference or Workshop Item
Language:English
Published: 2020
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Online Access:https://hdl.handle.net/10356/137974
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1379742020-04-20T14:40:33Z Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning Volkau, Ihar Abdul Mujeeb Dai, Wenting Erdt, Marius Sourin, Alexei School of Computer Science and Engineering School of Electrical and Electronic Engineering 2019 International Conference on Cyberworlds (CW) Fraunhofer Research Center Engineering::Computer science and engineering Automated Manufacturing Systems Cyber Manufacturing Automatic optical inspection for manufacturing traditionally was based on computer vision. However, there are emerging attempts to do it using deep learning approach. Deep convolutional neural network allows to learn semantic image features which could be used for defect detection in products. In contrast to the existing approaches where supervised or semi-supervised training is done on thousands of images of defects, we investigate whether unsupervised deep learning model for defect detection could be trained with orders of magnitude smaller amount of representative defect-free samples (tenths rather than thousands). This research is motivated by the fact that collection of large amounts of defective samples is difficult and expensive. Our model undergoes only one-class training and aims to extract distinctive semantic features from the normal samples in an unsupervised manner. We propose a variant of transfer learning, that consists of combination of unsupervised learning used upon VGG16 with pre-trained on ImageNet weight coefficients. To demonstrate a defect detection, we used a set of Printed Circuit Boards (PCBs) with different types of defects - scratch, missing washer/extra hole, abrasion, broken PCB edge. The trained model allows us to make clusters of normal internal representations of features of PCB in high-dimensional feature space, and to localize defective patches in PCB image based on distance from normal clusters. Initial results show that more than 90% of defects were detected. NRF (Natl Research Foundation, S’pore) Accepted version 2020-04-20T14:33:52Z 2020-04-20T14:33:52Z 2019 Conference Paper Volkau, I., Abdul Mujeeb, Dai, W., Erdt, M., & Sourin, A. (2019). Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning. Proceedings of the 2019 International Conference on Cyberworlds (CW), 101-108. doi:10.1109/CW.2019.00025 https://hdl.handle.net/10356/137974 10.1109/CW.2019.00025 101 108 en SMA-RP4 © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/CW.2019.00025 application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic Engineering::Computer science and engineering
Automated Manufacturing Systems
Cyber Manufacturing
spellingShingle Engineering::Computer science and engineering
Automated Manufacturing Systems
Cyber Manufacturing
Volkau, Ihar
Abdul Mujeeb
Dai, Wenting
Erdt, Marius
Sourin, Alexei
Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning
description Automatic optical inspection for manufacturing traditionally was based on computer vision. However, there are emerging attempts to do it using deep learning approach. Deep convolutional neural network allows to learn semantic image features which could be used for defect detection in products. In contrast to the existing approaches where supervised or semi-supervised training is done on thousands of images of defects, we investigate whether unsupervised deep learning model for defect detection could be trained with orders of magnitude smaller amount of representative defect-free samples (tenths rather than thousands). This research is motivated by the fact that collection of large amounts of defective samples is difficult and expensive. Our model undergoes only one-class training and aims to extract distinctive semantic features from the normal samples in an unsupervised manner. We propose a variant of transfer learning, that consists of combination of unsupervised learning used upon VGG16 with pre-trained on ImageNet weight coefficients. To demonstrate a defect detection, we used a set of Printed Circuit Boards (PCBs) with different types of defects - scratch, missing washer/extra hole, abrasion, broken PCB edge. The trained model allows us to make clusters of normal internal representations of features of PCB in high-dimensional feature space, and to localize defective patches in PCB image based on distance from normal clusters. Initial results show that more than 90% of defects were detected.
author2 School of Computer Science and Engineering
author_facet School of Computer Science and Engineering
Volkau, Ihar
Abdul Mujeeb
Dai, Wenting
Erdt, Marius
Sourin, Alexei
format Conference or Workshop Item
author Volkau, Ihar
Abdul Mujeeb
Dai, Wenting
Erdt, Marius
Sourin, Alexei
author_sort Volkau, Ihar
title Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning
title_short Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning
title_full Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning
title_fullStr Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning
title_full_unstemmed Detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning
title_sort detection defect in printed circuit boards using unsupervised feature extraction upon transfer learning
publishDate 2020
url https://hdl.handle.net/10356/137974
_version_ 1681058399973801984