Metallic nanoparticle inks for 3D printing of electronics

• Main Authors: Tan, Hong Wei, An, Jia, Chua, Chee Kai, Tran, Tuan
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2020
• Subjects: Engineering::Mechanical engineering; 3D Printing; 3D Printed Electronics
• Online Access: https://hdl.handle.net/10356/141374
• Institution: Nanyang Technological University

The three‐dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commonly used for fabricating conductive tracks and patterns due to their relatively high electrical conductivity as compared to other types of inks, and they can be further categorized into single‐element metallic nanoparticle inks, alloy metallic nanoparticle inks, metallic oxide nanoparticle inks, and core–shell bimetallic nanoparticle (BNP) inks. It is critical to gain a deep understanding of the metallic nanoparticle inks used in 3D printed electronics as the material properties of these inks can directly affect the final electrical and mechanical properties of the printed patterns. This review presents an overview of the available metallic nanoparticle inks used for 3D printing of electronics, and critically reviews the strengths and weaknesses of each type of ink. Finally, the challenges of metallic nanoparticle inks in 3D printed electronics are also discussed along with the future outlook for 3D printed electronics.