Improving ultrasonic embossing process of copper nanowire

• Main Author: Gui, Keith Zhi Peng
• Other Authors: Hong Li
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2020
• Subjects: Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/141396
• Institution: Nanyang Technological University

One-dimensional metallic nanostructures have been of great interest as their properties could be customized for specific applications through a variety of nanoimprinting methods. As most metallic nanowire arrays fabrication methods are limited by long fabrication time and high costs, ultrasonic nano...