Sample preparation for deprocessing of 3D multi-die stacked package

• المؤلفون الرئيسيون: Kor, Katherine Hwee Boon, Liu, Q., Gan, Chee Lip
• مؤلفون آخرون: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2020
• الموضوعات: Engineering::Materials; Deprocessing; 3D Multi-die Stacked Packages
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/144906

3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100...