Decapsulation of 3D multi-die stacked package

• Main Authors: Kor, Katherine Hwee Boon, Liu, Q., Siah, Yu Wen, Gan, Chee Lip
• Other Authors: School of Materials Science and Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2020
• Subjects: Engineering::Materials; Decapsulation; 3D Devices
• Online Access: https://hdl.handle.net/10356/143489
• Institution: Nanyang Technological University

Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation techn...