Decapsulation of 3D multi-die stacked package

Decapsulation of 3D multi-die stacked package

Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation techn...

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Main Authors: Kor, Katherine Hwee Boon, Liu, Q., Siah, Yu Wen, Gan, Chee Lip
Other Authors: School of Materials Science and Engineering
Format: Conference or Workshop Item
Language:English
Published: 2020
Subjects:
Engineering::Materials
Decapsulation
3D Devices
Online Access:https://hdl.handle.net/10356/143489
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1434892020-09-26T22:15:42Z Decapsulation of 3D multi-die stacked package Kor, Katherine Hwee Boon Liu, Q. Siah, Yu Wen Gan, Chee Lip School of Materials Science and Engineering 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Temasek Laboratories Engineering::Materials Decapsulation 3D Devices Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis. Accepted version 2020-09-04T06:32:55Z 2020-09-04T06:32:55Z 2015 Conference Paper Kor, K. H. B., Liu, Q., Siah, Y. W., & Gan, C. L. (2015). Decapsulation of 3D multi-die stacked package. 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 465-468. doi:10.1109/IPFA.2015.7224433 9781479999286 https://hdl.handle.net/10356/143489 10.1109/IPFA.2015.7224433 2-s2.0-84949744570 465 468 en © 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, in any current or future media, including reprinting/republishing this material for adverstising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at:https://doi.org/10.1109/IPFA.2015.7224433 application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic Engineering::Materials
Decapsulation
3D Devices
spellingShingle Engineering::Materials
Decapsulation
3D Devices
Kor, Katherine Hwee Boon
Liu, Q.
Siah, Yu Wen
Gan, Chee Lip
Decapsulation of 3D multi-die stacked package
description Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis.
author2 School of Materials Science and Engineering
author_facet School of Materials Science and Engineering
Kor, Katherine Hwee Boon
Liu, Q.
Siah, Yu Wen
Gan, Chee Lip
format Conference or Workshop Item
author Kor, Katherine Hwee Boon
Liu, Q.
Siah, Yu Wen
Gan, Chee Lip
author_sort Kor, Katherine Hwee Boon
title Decapsulation of 3D multi-die stacked package
title_short Decapsulation of 3D multi-die stacked package
title_full Decapsulation of 3D multi-die stacked package
title_fullStr Decapsulation of 3D multi-die stacked package
title_full_unstemmed Decapsulation of 3D multi-die stacked package
title_sort decapsulation of 3d multi-die stacked package
publishDate 2020
url https://hdl.handle.net/10356/143489
_version_ 1681058104683266048

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