Decapsulation of 3D multi-die stacked package

Decapsulation of 3D multi-die stacked package

Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation techn...

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Bibliographic Details
Main Authors: Kor, Katherine Hwee Boon, Liu, Q., Siah, Yu Wen, Gan, Chee Lip
Other Authors: School of Materials Science and Engineering
Format: Conference or Workshop Item
Language:English
Published: 2020
Subjects:
Engineering::Materials
Decapsulation
3D Devices
Online Access:https://hdl.handle.net/10356/143489
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Institution: Nanyang Technological University
Language: English
Description
Summary:Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis.

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