Hardware security assessment through repair of damaged device

In this paper, the feasibility of content access to physically damaged electronic device was explored by performing package level repair through transplantation of its intact silicon chip from its faulty substrate package onto another functional one, and establishment of new electrical connections b...

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Bibliographic Details
Main Authors: Sim, Siang Yee, Liu, Qing, Kor, Katherine Hwee Boon, Gan, Chee Lip
Other Authors: School of Materials Science and Engineering
Format: Conference or Workshop Item
Language:English
Published: 2024
Subjects:
Online Access:https://hdl.handle.net/10356/173637
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Institution: Nanyang Technological University
Language: English